Resin bond diamond grinding wheel for silicon wafer

//Resin bond diamond grinding wheel for silicon wafer

Resin bond diamond grinding wheel for silicon wafer

This type of resin bond diamond grinding wheel is used for silicon wafer grinding, it also suitable for single crystal silicon, polycrystalline silicon grinding, and bevelling.

Description

This type of resin bond diamond grinding wheel is used for silicon wafer grinding, it also suitable for single crystal silicon,polycrystalline silicon grinding and bevelling.

Standard size:200*62*80*5*7 and 200*62*80*15*10

Grit:100#—1000#

Following is the specification of this type of grinding wheels:

Silicon wafer grinding wheel size chart

Diameter Thickness Hole Rim Width Rim Thickness
200 35 76 3,5,6,9 3~8
200 50 80 3,5,6,9 3~8
200 60 80 3,5,6,9 3~8
220 65 180 3,5,6,9 3~8
300~350 20~40 127 5,7 3~8

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