Vitrified Grinding Wheels for LED Substrate

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Vitrified Grinding Wheels for LED Substrate2018-12-12T21:08:17+00:00

Project Description

  • Grinding-Wheels-for-LED-Substrate
Material:Diamond
Bond:Vitrified
Tech:Sintered
Mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
1, High grinding efficiency
2, Good surface finishing
3, Good self sharpening
4, Long service life
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